Harris, Tektronix Component Solutions sign strategic partnership agreement

  • 30-Jun-2011 07:47 EDT

Harris Corp. and Tektronix Component Solutions have established a strategic partnership agreement. The agreement, in effect now, is intended to enhance collaboration, share technology and strategy development, improve program execution, and, ultimately, enable greater growth for both companies. Through the agreement, the two companies will look to translate the communications expertise of Harris and Tektronix Component Solutions' microelectronics engineering skill to better meet evolving customer needs for greater performance while reducing size, weight, and power. For more than 13 years, Tektronix Component Solutions and Harris have worked together to develop and deliver quality, high-performance intra-aircraft communications systems for next-generation military aircraft, including most recently the F-22A Raptor and F-35 Lightning II. Individual products have included multichip modules, fiber-optic transmitters and receivers, and electro-optic transceivers.

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Equipment developers are moving quickly to ensure that military users will have long-term access to boards and modules that provide higher performance, easy replacement, and reduced costs. Board and system designers adopting new technologies are standardizing interconnection layouts to ensure that boards designed by various suppliers can be used to upgrade systems as technology advances.

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