Harris, Tektronix Component Solutions sign strategic partnership agreement

  • 30-Jun-2011 07:47 EDT

Harris Corp. and Tektronix Component Solutions have established a strategic partnership agreement. The agreement, in effect now, is intended to enhance collaboration, share technology and strategy development, improve program execution, and, ultimately, enable greater growth for both companies. Through the agreement, the two companies will look to translate the communications expertise of Harris and Tektronix Component Solutions' microelectronics engineering skill to better meet evolving customer needs for greater performance while reducing size, weight, and power. For more than 13 years, Tektronix Component Solutions and Harris have worked together to develop and deliver quality, high-performance intra-aircraft communications systems for next-generation military aircraft, including most recently the F-22A Raptor and F-35 Lightning II. Individual products have included multichip modules, fiber-optic transmitters and receivers, and electro-optic transceivers.

Share
HTML for Linking to Page
Page URL
Grade
Rate It
5.00 Avg. Rating

Read More Articles On

2016-12-20
Researchers from Iowa State University are expanding fundamental materials studies into research and development of new, all-solid-state technology for batteries.
2017-01-31
The 2016 Unmanned Canada (UC) conference, hosted in Alberta, provided a venue for many specialist companies to outline their programs for new UAV technologies, capabilities, products, and services.
2017-01-03
NRL scientists have demonstrated metallic spin filtering at room temperature using ferromagnet-graphene-ferromagnet thin film junction devices.
2017-03-28
Northrop Grumman recently completed its successful inaugural flight test of the UTC Aerospace Systems MS-177 sensor payload on an RQ-4 Global Hawk. The ability to carry more powerful sensors close the capability gap between the RQ-4 and soon-to-be-retired Lockheed U-2.

Related Items

Training / Education
2018-03-06
Training / Education
2018-03-12
Technical Paper / Journal Article
2010-10-25