Mitsubishi Electric’s transfer-molded power module (T-PM) is mainly designed for hybrid- and electric-vehicle applications. With a claimed life span 30 times longer than that of industrial power modules, the J Series T-PM is completely lead-free. The device offers enhanced reliability by incorporating Mitsubishi Electric’s original, inner connection technology called direct lead bonding (DLB). DLB reduces power loss through decreasing wiring resistance and inductance in modules by way of an extended main terminal that is sufficiently long to be bonded directly to the power chip. Designed specifically for automotive applications, the J-Series T-PM features two carrier-stored trench gate bipolar transistor IGBT chips incorporated in a 600-v/300-A power module.