HTCC connectors

  • 13-Dec-2010 02:47 EST
HTCC composite 300DPI.jpg

Souriau PA&E Micro-D connectors incorporate high-temperature co-fired ceramic (HTCC) technology to provide high levels of mechanical performance and superior wire bonding density. The technology is typically used in high-reliability applications such as defense/aerospace electronics, IR sensors, and optoelectronics. The connector’s external sockets are mated to an HTCC board that integrates metalized circuit patterns, rather than traditional pins. This approach saves space and reduces wire-bonding complexity while maintaining high standards for harsh-environment reliability and electrical performance. The connectors are MIL-PRF-83513 interface compliant and designed to be laser welded into aluminum, titanium, or iron/nickel alloy electronic housings.

HTML for Linking to Page
Page URL
Rate It
0.00 Avg. Rating

Read More Articles On

It is clear that as each new airplane design emerges, the trend toward more electrically powered systems is going to gain momentum. EPSs offer improved performance and reliability while saving weight.
Deemed "the first" 3D printed metal radio frequency filter for use in a telecommunications satellite, the filter, a culmination of the research funded by the European Space Agency, was created using a direct-metal-printing process.
Exclusive rights to the use of ultra-black Vantablack S-VIS surface coating in blackbody calibration sources has been agreed between Surrey NanoSystems and Santa Barbara Infrared (SBIR).
Metamaterial Technologies looks to enter the solar power market by providing advanced photovoltaic technology to the aerospace and defense industry.

Related Items

Technical Paper / Journal Article
Technical Paper / Journal Article
Technical Paper / Journal Article
Training / Education
Technical Paper / Journal Article
Training / Education