Souriau PA&E Micro-D connectors incorporate high-temperature co-fired ceramic (HTCC) technology to provide high levels of mechanical performance and superior wire bonding density. The technology is typically used in high-reliability applications such as defense/aerospace electronics, IR sensors, and optoelectronics. The connector’s external sockets are mated to an HTCC board that integrates metalized circuit patterns, rather than traditional pins. This approach saves space and reduces wire-bonding complexity while maintaining high standards for harsh-environment reliability and electrical performance. The connectors are MIL-PRF-83513 interface compliant and designed to be laser welded into aluminum, titanium, or iron/nickel alloy electronic housings.