GE to locate new R&D center in Ohio's Aerospace Hub

  • 06-Dec-2010 01:50 EST
ge_rendering_700x360_11222010.jpg

An artist's rendering of GE Aviation's EPISCENTER research and development project. The 115,000-ft² building is expected to open at the end of 2012.

GE Aviation announced plans to locate a new Electrical Power Integrated Systems Research and Development Center (EPISCENTER) on the University of Dayton campus in Dayton, OH. The proposed site is located in the Ohio Aerospace Hub of Innovation, enabling GE Aviation to participate as an initial launch partner of the Hub. The center will be a catalyst for new contracts and products resulting in job growth at the EPISCENTER and at GE locations such as Vandalia. The $51 million center will be built on about 8 acres. The university will work with CityWide Development Corp. to build the facility. GE anticipates entering into a long-term lease agreement with the University of Dayton and CityWide following an environmental review and clearance. The 115,000-ft² facility is expected to be completed by the third quarter of 2012 and operational by the end of 2012.

Share
HTML for Linking to Page
Page URL
Grade
Rate It
3.00 Avg. Rating

Read More Articles On

2016-12-04
Swamy Kotagiri will discuss how to foster an innovative organizational culture during a Leadership Summit roundtable, April 4 at the SAE WCX17 in Detroit. He spoke recently with Automotive Engineering on this topic at Magna’s Troy, MI, offices during the company's annual Innovation Awards activity.
2016-11-29
While Donald Trump was blasting China for allegedly taking U.S. jobs, GM was quietly importing new China-made vehicles into the U.S.
2016-11-30
Attention to detail in NVH reduction, build quality and overall refinement mark Ford's development focus for its global B-segment veteran.
2017-01-08
Kia's racy 2018 Stinger is the brand's first rear-drive and AWD sedan.

Related Items

Training / Education
2017-10-31
Technical Paper / Journal Article
2004-07-19
Training / Education
2017-11-01
Book
2012-11-01
Technical Paper / Journal Article
2004-07-19