IC thermal detection

  • 05-Apr-2010 08:59 EDT
THERMAL-SCAN-RED.jpg

Two Flying IC Thermal Detection Units, added by Seica to its Aerial flying prober line, are positioned on each side of an integrated circuit under test to detect thermal parameters of the IC under power. The units compare temperatures of known good boards to suspect boards and identify bad components. The Aerial Prober, based on VIVA Integrated Platform core hardware and software, reduces the investment and time needed for board development while maximizing test flexibility. The four independent mobile test probes enable simultaneous, accurate double-sided testing, while the One Touch Per Net method quickly characterizes the net and identifies faults on subsequent test boards. The system adds to the traditional features already present on flying probers, such as in-circuit, functional, boundary scan, and power-up test, making the flying prober an evolving test tool for production and depot repair markets.

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