DLCC diodes

  • 05-Mar-2010 09:20 EST
SL007 DLCC Image.jpg

Semelab’s ceramic diode leadless chip carrier packages provide drop-in replacement for metal electrode leadless face-type devices. The components are suited for military, aerospace, avionics, and high-temperature applications. The DLCC diodes provide enhanced thermal performance and better solderability in a fully hermetic surface-mount ceramic package. Advanced packaging design features include thermal vias that improve heat transfer to the solder pads, reducing the diode’s junction temperature and increasing its operating lifetime. Castellated terminations ensure that the solder meniscus between the PCB and the device is visible for inspection.

HTML for Linking to Page
Page URL
Rate It
0.00 Avg. Rating

Read More Articles On

Equipment developers are moving quickly to ensure that military users will have long-term access to boards and modules that provide higher performance, easy replacement, and reduced costs. Board and system designers adopting new technologies are standardizing interconnection layouts to ensure that boards designed by various suppliers can be used to upgrade systems as technology advances.

Related Items

Technical Paper / Journal Article