Semelab’s ceramic diode leadless chip carrier packages provide drop-in replacement for metal electrode leadless face-type devices. The components are suited for military, aerospace, avionics, and high-temperature applications. The DLCC diodes provide enhanced thermal performance and better solderability in a fully hermetic surface-mount ceramic package. Advanced packaging design features include thermal vias that improve heat transfer to the solder pads, reducing the diode’s junction temperature and increasing its operating lifetime. Castellated terminations ensure that the solder meniscus between the PCB and the device is visible for inspection.