EMI/RF shields

  • 22-Feb-2010 09:34 EST

Electromagnetic interference/RF shields from Photofabrication Engineering feature snap-on, snap-off covers that allow easy access to components within the shields. The shields protect components from EMI/RF interference and environmental hazards while providing electrical grounding. Standard forming tools in any size and shape are used to create covers that attach onto a fence yet can be removed and replaced easily. The photochemically etched fences have grooves extending approximately 50% into the material thickness to enable the custom spring finger designs to snap into them firmly. Circuit-board shielding applications include one-piece or two-piece construction; standard base materials of brass, tin, tin-lead, nickel, copper, and cold-rolled steel; and nickel-silver base material.

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Equipment developers are moving quickly to ensure that military users will have long-term access to boards and modules that provide higher performance, easy replacement, and reduced costs. Board and system designers adopting new technologies are standardizing interconnection layouts to ensure that boards designed by various suppliers can be used to upgrade systems as technology advances.

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