Thermal gap filler

  • 22-Jan-2010 03:29 EST
TP-S3LS Thermal Gap Filler from MH&W.jpg

TP-S3LS ultralow silicone gap fillers from MH&W International contain less than 50 ppm of silicone while providing 3 W/mK of thermal conductivity between hot components and their heat sinks. The gap filler’s minimal silicone content makes it suitable for use in silicone-sensitive applications including laser optics and telecommunications, where silicone-based outgassing can lead to contamination and condensation issues or leave oily residues that interfere with process applications. The family of materials was developed by Chang Sung Corp. and is manufactured by Dongyun Electronics. Pads of the material are soft and compliant for easy compression and filling of air gaps between irregular mating surfaces. The material’s Shore 00 hardness is 55. The pads can be used in temperatures up to 200°C.

Author:
Sector:
Topic:
Mentions:
Share
HTML for Linking to Page
Page URL
Grade
Rate It
0.00 Avg. Rating

Read More Articles On

2016-12-20
Researchers from Iowa State University are expanding fundamental materials studies into research and development of new, all-solid-state technology for batteries.
2017-02-20
Researchers from Purdue University are studying the fundamental mechanisms behind a method that uses electrical fields to enhance ceramics-sintering processing, which could aid R&D of rechargeable lithium-ion batteries and fuel cells. The research also could shed light on a phenomenon called electromigration, which can affect the performance of electronic devices.
2016-10-20
The fusing of emerging technologies from the aerospace materials sector and biological sciences are now, for the first time, heading toward the prospect of growing parts, systems, and, ultimately, perhaps whole aircraft.
2016-10-22
There is a general consensus among experts that it will take vast advances in materials technology to meet future efficiency and emissions requirements that can truly only be speculated about today.

Related Items

Training / Education
2013-04-09
Training / Education
2013-04-09
Technical Paper / Journal Article
2010-10-25
Training / Education
2013-04-09