Thermal gap filler

  • 22-Jan-2010 03:29 EST
TP-S3LS Thermal Gap Filler from MH&W.jpg

TP-S3LS ultralow silicone gap fillers from MH&W International contain less than 50 ppm of silicone while providing 3 W/mK of thermal conductivity between hot components and their heat sinks. The gap filler’s minimal silicone content makes it suitable for use in silicone-sensitive applications including laser optics and telecommunications, where silicone-based outgassing can lead to contamination and condensation issues or leave oily residues that interfere with process applications. The family of materials was developed by Chang Sung Corp. and is manufactured by Dongyun Electronics. Pads of the material are soft and compliant for easy compression and filling of air gaps between irregular mating surfaces. The material’s Shore 00 hardness is 55. The pads can be used in temperatures up to 200°C.

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