Raytheon developing self-healing integrated circuits

  • 22-Oct-2009 09:46 EDT

DARPA awarded Raytheon Co. a $5.5 million contract to design, fabricate, and test self-healing mixed-signal integrated circuits (HEALICS) technology. Raytheon's HEALICS effort incorporates self-healing into a complex system-on-chip (SOC) design, providing the capability for the chip to sense undesired circuit behaviors and correct them automatically. This feature maximizes the yield of increasingly complex mixed-signal SOCs on an individual wafer to meet demanding performance specifications in the presence of extreme process variations and environment conditions. Raytheon is partnering with the California Institute of Technology and North Carolina State University for this program.

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