The EP21TCHT-1 epoxy from Master Bond cures at room temperature and has high thermal conductivity and enhanced electrical insulation properties. The material operates at temperatures up to 400°F and has a low thermal expansion coefficient. It is NASA-qualified for low outgassing applications and is recommended for use in vacuum environments. The epoxy has high physical strength properties and provides adhesion to metals, ceramics, woods, vulcanized rubbers, and most plastics. Bonds are resistant to water, fuels, and most organic solvents.