Version 4.0 of ANSYS SIwave software includes new features for signal and power integrity and electromagnetic compatibility testing. Part of the Ansoft family of products, version 4.0 offers several enhancements including an improved desktop graphical user interface with post processing of results, solver enhancements that provide accurate solutions beyond 10 Gb/s, and automation that links SIwave electromagnetics with circuit simulation using Ansoft Designer and Nexxim. In addition, a new link between electromagnetics and thermal analysis has been created for board and package thermal effects via ANSYS Icepak software. According to the company, the link enables accurate characterization of additional heating due to copper-resistive losses that engineers have previously estimated or ignored completely. SIwave software offers comprehensive electromagnetic interference and compatibility analyses. It also has the ability to couple board and package electromagnetic fields with HFSS technology for complete system-level simulation.