Dual-device MOSFET

  • 08-Jul-2009 02:36 EDT
DI0575_DMS-DMP.jpg

Diodes' fe­atures three dual-device MOSFET/diode combinations in thermally efficient, ultrasmall DFN packaging. ­Enhanced by the use of Diodes' own high-performance diode, the SBR rectifier, the packages save space and increase the performance of charging and switching applications in portable electronic devices. Models DMS2220LFDB and DMS2120LFWB co-package a 20-V P-channel enhancement-mode MOSFET with a companion diode in a choice of 2 x 2 mm (0.08 x 0.08 in) DFN2020 and 3 x 2 mm (0.12 x 0.08 in) DFN3020 packages, while model DMP2160UFDB co-packages two of the same MOSFETs in the DFN2020 format. The DFN2020 package requires 55% less printed circuit board (PCB) space than the 3 x 3 mm (0.12 x 0.12 in) footprint packages traditionally used in portable application designs. An off-board height of 0.5 mm (0.019 in) means the package is also 50% thinner, optimizing next-generation product design.

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