X-ray system

  • 30-Jun-2008 09:52 EDT
Medalist x6000.jpg

 

The Agilent Medalist x6000 automated X-ray inspection (AXI) system from Agilent Technologies finds defects in solder joints to improve end-product quality and decrease warranty repair and scrap costs. Features of the system include 3-D inspection that achieves more than 90% defect coverage, according to the company, and simultaneous 3-D X-ray inspection of double-sided panels at throughput rates that match most medium- to high-complexity printed circuit board assemblies (PCBAs). Designed for in- or off-line automated X-ray process testing of lead or lead-free solder joints on PCBAs with user-configurable pass-through or pass-back loading, the x6000 features a maximum image acquisition rate of 32.3 cm²/sec and was designed to prevent electrical, mechanical, and radiation hazards to the operator.

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