Hermetic microelectronics

  • 19-Jun-2008 09:37 EDT
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CPS Technologies’ TO-250 type products can be made in various combinations and consist of a cold-rolled steel frame with hermetic seals made with alloy #52 or copper cored alloy #52 pins in a compression glass seal or ceramic terminal. Bottom choices can be OFHC copper, copper molybdenum, copper tungsten, or Glidcop. Braze material is 72% Ag/28% Cu (BT braze). The hermetic microelectronic packages enable successful communication for military and other harsh-environment applications.

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