Engineers across disciplines will realize step-change improvements in the way they develop products using ANSYS 17.0. This next generation of ANSYS delivers 10× improvements to product development productivity, insight, and performance. Highlights of the release include: a comprehensive chip-package-system design workflow with new capabilities for automated thermal analysis and integrated structural analysis that enables customers to deliver smaller, higher-power density devices to market faster. The fluids suite includes advancements in physics modeling and innovations across the entire workflow and user environment design that accelerate time to results by up to 85% without compromising accuracy. Preprocessing has also improved by an order of magnitude. Using the direct-modeling tools in ANSYS 17.0, users can prepare their geometry for analysis faster than with traditional CAD. Save and load times for complex models, as well as the performance for common geometry editing functions, have increased by up to 100×. Geometry tools also boast tighter integration to ANSYS Workbench and offer productivity advancements for modeling fabricated and composite structures. Fluids pre-processing for complex systems has also improved dramatically. The process of preparing and meshing models with hundreds of parts has been reduced from days to hours. The release enables software engineers to be more productive with developing, testing, and certifying embedded software. For example, with printed circuit boards, engineers can now quickly import ECAD geometry and perform coupled thermal-structural analysis with power integrity and electronics cooling analyses to accurately predict stress, deformation, and fatigue. These capabilities enable engineers to design board layouts and thermal-management strategies for more reliable electronic components. As a result, complex boards and packages can be set up and solved in minutes, not hours or days. For more information, visit www.ansys.com/17.