MEMS wafer inspection

  • 04-Aug-2014 10:41 EDT
MEMS Seal Defects.jpg

Sonoscan’s AW322 200 automated system for ultrasonic inspection of MEMS wafers images and identifies internal gap-type defects down to 5 µm in size. It is especially useful for finding non-bonds, voids, and other defects in the seals surrounding the MEMS wafer cavities. System features include two loadports, two stages, and multiple transducers, enabling it to image two 8-in MEMS wafers simultaneously. Other models in the series accommodate wafer sizes of 100-300 mm. In operation, the robotic handling station counts and unloads wafers from the carriers, aligns wafers for scanning, and positions wafers on the stage. After scanning, both the acoustic wafer image and the wafer data can be used for accept/reject determination.

Share
HTML for Linking to Page
Page URL
Grade
Rate It
0.00 Avg. Rating

Read More Articles On

2016-10-20
The fusing of emerging technologies from the aerospace materials sector and biological sciences are now, for the first time, heading toward the prospect of growing parts, systems, and, ultimately, perhaps whole aircraft.
2017-01-03
NRL scientists have demonstrated metallic spin filtering at room temperature using ferromagnet-graphene-ferromagnet thin film junction devices.
2016-12-20
Industrial aluminum slabs are typically produced by blending small amounts of copper or manganese in a reservoir of molten aluminum that is rapidly cooled, a process known as direct-chill casting. Variations in the way these elements solidify can yield uneven results that weaken the final product.
2016-10-18
Researchers from the U.S. Naval Research Laboratory's Optical Sciences Division and Material Science Division have detected acoustic emissions from cracks in riveted lap joints using a distributed feedback fiber laser-acoustic emission sensor.

Related Items

Training / Education
2013-04-09
Technical Paper / Journal Article
2011-04-12
Training / Education
2013-02-20
Technical Paper / Journal Article
2011-04-12