Quick release interconnect

  • 01-Oct-2013 09:08 EDT
RADLOK 2.0 APL-A-5061.jpg

Amphenol Industrial Global Operation's Radlok low-profile, quick-release interconnect uses R4 Radsok technology. The product line provides low insertion and extraction forces with a high-mating cycle rating for high-power interconnects, making it suitable for frequent mating applications. A versatile, right-angle design can be used in the heavy equipment, automotive, power/battery storage, and hybrid-electric system markets, and an integrated positive mechanical lock/release feature improves cycle durability. Radsok technology lowers voltage drop, maximizes contact surface, and reduces temperature rise, and the connection system features a low-profile, one-piece over mold design for impact resistance and reduced assembly costs. RoHS-compliant connectors have a maximum current rating of 400 A, a maximum dc voltage rating of 1000 V, and an operating temperature range of -40 to +125°C (-40 to +257°F).

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