Sonoscan’s Digital Image Analysis Toolbox is used for automated acoustic analysis of individual IC components, various types of bonded wafers including MEMS, and other devices. The DIA Toolbox is used for sorting components automatically into accept/reject or multiple defined categories. It contains predefined common analysis tools, including interface analysis, which nondestructively determines the bond between two surfaces in a package; wafer bond analysis, which is used to quantify the number of voids or nonbonds between two bonded wafers; and chip-on-wafer analysis, which measures the quality of the bumps and underfill between the chip and the wafer and outputs a location-specific report. The tool has multiple wizards to establish inspection parameters quickly. Users can also create new tool variations.