Digital image analysis

  • 16-Aug-2013 02:13 EDT
Sonoscan DIA Toolbox pix.jpg

Sonoscan’s Digital Image Analysis Toolbox is used for automated acoustic analysis of individual IC components, various types of bonded wafers including MEMS, and other devices. The DIA Toolbox is used for sorting components automatically into accept/reject or multiple defined categories. It contains predefined common analysis tools, including interface analysis, which nondestructively determines the bond between two surfaces in a package; wafer bond analysis, which is used to quantify the number of voids or nonbonds between two bonded wafers; and chip-on-wafer analysis, which measures the quality of the bumps and underfill between the chip and the wafer and outputs a location-specific report. The tool has multiple wizards to establish inspection parameters quickly. Users can also create new tool variations.


Share
HTML for Linking to Page
Page URL
Grade
Rate It
0.00 Avg. Rating

Read More Articles On

2016-10-20
The fusing of emerging technologies from the aerospace materials sector and biological sciences are now, for the first time, heading toward the prospect of growing parts, systems, and, ultimately, perhaps whole aircraft.
2017-01-03
NRL scientists have demonstrated metallic spin filtering at room temperature using ferromagnet-graphene-ferromagnet thin film junction devices.
2016-12-20
Industrial aluminum slabs are typically produced by blending small amounts of copper or manganese in a reservoir of molten aluminum that is rapidly cooled, a process known as direct-chill casting. Variations in the way these elements solidify can yield uneven results that weaken the final product.
2017-06-27
Recently NASA researchers were officially cleared to begin formal feasibility studies on advanced Unmanned Aircraft System (UAS) concepts under NASA’s Convergent Aeronautics Solutions (CAS) project. The investigations, three in total, are expected to take between 24 and 30 months to complete.

Related Items

Training / Education
2013-04-09
Training / Education
2013-04-09
Technical Paper / Journal Article
2011-04-12
Technical Paper / Journal Article
2011-04-12
Training / Education
2013-04-09