Lockheed Martin and Singapore's Nanyang Technological University (NTU) signed a memorandum of understanding (MOU) to explore the science of nanotechnology, with special focus on nanocopper and related technologies for the commercial market. Lockheed Martin and NTU will set up a joint research laboratory at NTU's Yunnan campus. The lab will allow NTU students and faculty to work directly with Lockheed Martin scientists on developing the nanocopper CuantumFuse technology platform, which can be used for a variety of high-tech applications. Nanocopper is the main ingredient in the advanced electrical interconnect material, or solder. Known as the CuantumFuse solder, this material is expected to produce joints with up to 10 times the electrical and thermal conductivity compared to tin-based materials currently in use.