Osram Opto Semiconductors develops a uniform solder pad concept that allows second sourcing of LEDs from different manufacturers, decreasing storage costs and process modification. Although standard security practice for LED components, second-sourced products generally differ in terms of dimension and shape, requiring two different soldering boards. Osram’s concept ceramic LED components make the solder pad board design adaptable for use with components from at least two manufacturers. Individual solder surfaces on the combined board are divided into segments: electrically connected and electrically disconnected. By selecting appropriate spacing between the solder surfaces, the second LED is rotated 90° and is attached to the uniform board design without changing the components or the end application. The concept also can be used for metal core, FR4, and ceramic boards.